Enable Quota
1 | % cat /etc/fstab |
Looking at the last line of /etc/fstab above, both usrquota and grpquota are added in option domain.
1 | % cat /etc/fstab |
Looking at the last line of /etc/fstab above, both usrquota and grpquota are added in option domain.
2022/5/11
全市新增确诊 | 全市新增无症状 | 浦东新增确诊 | 浦东新增无症状 |
---|---|---|---|
144 | 1305 | 9 | 240 |
5/9 - 新增确诊234,新增无症状2780
PT-PX is PrimeTime with power analysis. It’s a tool within PT (requires separate license of PT-PX). PT-PX combines simulation time window to report power within a window.
pt_shell-2012.12-SP3 -f scripts/run_power.tcl |tee logs/run_power.log
=> can be invoked in gui mode too.
run_power.tcl has following cmds:
We learned OCV in a few other posts. However running OCV at 2 different PVT corners may not always be practical. For ex, consider the voltage drops seen on a chip due to IR. We may not be able to get lib at that particular voltage corner after accounting for the voltage drop due to IR. Similarly for temperature, we may not be able to lib for that exact temperature after accounting for on chip heating. Also, even if we are able to get these libs, ocv analysis requires running at 2 extreme corners. If we do not want to run analysis at 2 diff corners for ocv, we can run it at 1 corner only by specifying derating. Derating is an alternate approach where we speed up or slow down certain paths so that they can indirectly achieve same results as OCV. Derating is basically applying a certain multiplying factor to each gate delay so that the delay can be scaled up (by having a multiplying factor > 1), or can be scaled down (by having a multiplying factor < 1). The advantage of derate is that each and every gate in design can now be customized to have a particular delay on it. With OCV analysis, we weren’t able to do this, as the flow just chose b/w WC and BC lib and applied one or the other to each gate in design. Here, we first choose a nominal voltage, for which we have library available, and then apply derate to achieve effects of Voltage and Temperature variations.
芯片在实际生产中,同一片晶圆上的不同区域的芯片,因为各种外部条件和生产条件的变化(variation),比如:工艺(Process),电压(Voltage),温度(Temperature)等,可能会产生不同的误差从而导致同一块晶圆上某些区域上的芯片里的晶体管整体速度变快或变慢,因此有了corner的概念。而与此同时,在同一块芯片上的不同区域,也会因为上述因素而有进一步的差异(variation),因此产生了OCV(On Chip Variation)的概念。
Corner vs. OCV
Foundation | ROs | Linux O/S Versions | Windows Platform |
---|---|---|---|
U | 2023.06 | CentOS: 7.3+ RHEL: 7.3+; 8+ SLES: 12-SP4+; 15+ | Windows 10 Windows Server 2016 Windows Server 2019 |
U | 2023.03 | ||
U | 2022.12 | ||
T | 2022.09 | CentOS: 7.3+ RHEL: 7.3+; 8+ SLES: 12-SP4+; 15+ | Windows 10 Windows Server 2016 Windows Server 2019 |
T | 2022.06 | ||
T | 2022.03 | ||
S | 2021.12 | CentOS: 7.3+; 8+ RHEL: 7.3+; 8+ SLES: 12-SP4+; 15+ | Windows 10 Windows Server 2016 |
S | 2021.09 | ||
S | 2021.06 | ||
R | 2021.03 | RHEL 6.6+, 7.x, 8+ CentOS 6.6+, 7.1.1503+, 8+ SLES 12+, 15+ | Windows7, 10Windows Server 2016 |
R | 2020.12 | ||
R | 2020.09 | ||
Q | 2020.06 | RHEL 6.6+, 7.x, 8+ CentOS 6.6+, 7.1.1503+, 8+ SLES 12+, 15+ | Windows7, 10Windows Server 2008 R2, 2016 |
Q | 2020.03 | ||
Q | 2019.12 | ||
P | 2019.09 | RHEL 6.6+, 7.x CentOS 6.6+, 7.x SLES 11.4+ and 12.x | Windows 7, 10Windows Server 2008 R2, 2016 |
P | 2019.06 | ||
P | 2019.03 | ||
O | 2018.12 | RHEL 6.6+, 7.x CentOS 6.6+, 7.x SLES 11.4 and 12.x | Windows 7, 10Windows Server 2008 R2, 2016 |
O | 2018.09 | ||
O | 2018.06 | ||
N | 2018.03 | RHEL 6.6+, 7.x SLES 11.x and 12.x | Windows 7, 8, 10 |
N | 2017.12 | ||
N | 2017.09 | ||
M | 2017.06 | RHEL 6.6+, 7.x SLES 11.x and 12.x | Windows 7, 8, 10 |
M | 2017.03 | ||
M | 2016.12 |